EXC-3071X (2 port 10Gig LAN)

Overview

Workstation-grade Platform : Intel® Core™ i9/i7/i5/i3 Processor (14th gen, codename : RPL-S Refresh/RPL-S/ADL-S) with Intel® R680E Chipset, fanless -40°C to 75°C operating temperature, multiple 10G LAN/2.5G LAN/GigE LAN/SIM socket configuration, max 6 USB 3.2 Gen 2 connections supporting up to 10Gbps data rate, outstanding system performance, 5G/WiFi 6/4G/3G/LTE/GPRS/UMTS mobile availability, DC 9V to 50V power input. Software ignition power control and rugged reliability in harsh environments, all-in-one integrated features, Vecow ECX-3000 Series Fanless Embedded System is your new generation choices for Machine Vision, In-vehicle Computing, Public Security, Factory Automation, Intelligent Transportation System (ITS), Robotic Control, AMR/AGV, Deep Learning, and any Edge AI applications.

EXC-3071X is certified to CE, FCC, EN50155 and EN50121-3-2.

Features

• Workstation-grade Platform : Intel® Core™ i9/i7/i5/i3 Processor (14th gen, codename : RPL-S Refresh/RPL-S/ADL-S) running with Intel® R680E PCH supports max 65W TDP CPU
• Intel® UHD Graphics 770/730 driven by Intel® Xe architecture with up to 32 graphics execution units (EUs) delivers immersive interactions with integrated graphics and accelerated AI performance
• 2 10GigE LAN, 5 2.5GigE LAN with 4 IEEE 802.3at PoE+
• 2 Front-access 2.5" SSD Tray, 6 USB 3.2 Gen 2
• DC 9V to 50V Power Input, Software Ignition Control
• Supports Intel® vPro, TPM 2.0 and Time-Sensitive Networking (TSN)
• Optional VHub One-Stop AIoT Solution Service supports OpenVINO based AI accelerator and advanced Edge AI applications

The Latest Edge AI Accelerator 

• Workstation-grade Platform : Intel® Core™ i9/i7/i5/i3 Processor (14th gen, codename : RPL-S Refresh/RPL-S/ADL-S), up to 65W TDP CPU supported
• Breakthrough core technology features performance hybrid architecture supporting up to 16 cores and 24 threads outstanding Multi Threaded performance with Intel Thread Director      
• Intel UHD Graphics 770 driven by Intel® Xe Architecture with up to 32 graphics execution units (EUs) to support AI workload parallelization   
• High-speed data transfer : PCIe 4.0 (16GT/s), USB 3.2 Gen 2 (10G), 10GigE LAN (10G), SATA III (6G), 2.5GigE LAN (2.5G), GigE LAN (1G)

• Max 9 GigE LAN with 4 IEEE 802.3at 2.5G PoE+ (25.5W/48V)       
• 6 10G USB 3.2 Gen 2, up to 4 COM RS-232/422/485, 2 SIM Socket, 16 Isolated DIO, SUMIT A, B   
• Dual external 2.5” SSD trays, optional supports 4 front-access M.2 SSD trays 
• Compact Configurations : M.2 Key B, M.2 Key E, M.2 Key M 
• Wireless Connections : 5G/WiFi 6/4G/3G/LTE/GPRS/UMTS
• Multiple displays : Dual DisplayPort, DVI-I and HDMI four independent 4K displays or one 8K display
• Versatile Ethernet Offerings : 10G LAN/2.5G PoE+/2.5G LAN/GigE LAN 
• Intel Deep Learning Boost (Intel DL Boost) and Intel Distribution of OpenVINO toolkit for AI Computing

• Fanless -40°C to 75°C operation
• ECC Memory supported   
• Always-on wireless communication supports seamless data delivery   
• Optional SUMIT A and SUMIT B support versatile scalability 
• DC 9V to 50V Wide Range Power Input 
• Ignition Power Control for in-vehicle applications
• EN50155 & EN50121-3-2
• Anti-shock, Anti-vibration

• User-friendly chassis design supports easier system maintenance  
• Considerate Toolless SIM Card sockets and RTC Battery Socket Cover   
• Front-access & lockable SSD trays, RAID 0, 1 data protection 
• Software Ignition Power Control, Remote Power Switch 
• Real-time capable with Intel Time Coordinated Computing (Intel TCC) and support for Time-Sensitive Networking (TSN)
• Smart System Manageability : iAMT, TPM 2.0, PXE, Wake on LAN, Watchdog Timer