SPC-9100

Overview

The Vecow SPC-9000 is an Ultra-compact Fanless Embedded System powered by the latest Intel® Core Ultra Processor, providing an optimal balance of performance and power efficiency. The SPC-9000 delivers improved performance and I/O interfaces including 2 USB 3.2 Gen 2, 1 USB Type-C, 2 2.5G LAN, 3 M.2 sockets for storage and expansion. The optional SUMIT socket is capable of supporting 10GigE LAN, 10G SFP+, and 4G networks accessible via the SIM socket. To meet industrial environments, the SPC-9000 support a wide range of power input from 9V to 55V and ensures operation within a temperature range from -40°C to 75°C, making it a perfect solution for Factory Automation, Service Robot, V2X, Smart Retail and other Edge AI applications.

The Ultra Compact Series embedded fanless systems are certified to CE, FCC, EN60945, EN50155 and EN50121-3-2 (Rolling Stock).

Features

• Intel® Core™ Ultra processors feature a hybrid CPU/GPU/NPU architecture, improving CPU productivity by up to 14%.
• Advanced Intel® AI Boost NPU delivers 11 TOPS AI-focused performance
• Compact Design, fanless -40°C to 75°C Operation
• DC 9V to 55V Power Input, Software Ignition Power Control
• 2 USB 3.2 Gen 2, 1 USB 3.2 Gen 2x2 Type-C with DP, HDMI and DisplayPort
• 2 2.5G LAN, 3 M.2 Socket for storage and expansion
• Optional SUMIT B expansions for 10GigE LAN, 10G SFP+, or 4G Networks
• Supports Intel® vPro, TSN, TCC, and TPM 2.0
• Optional VHub One-Stop AIoT Solution Service supports OpenVINO™ toolkit for AI Computing 

Accelerated AI-Ready Platform

• Intel Core Ultra Processor featuring performance hybrid architecture improves up to 2.56x power efficiency for AI computing than the former generation
• 12-core 15W TDP CPU, multiple compute engines in one SoC : CPU (P-cores, E-cores), GPU, and NPU (Intel AI Boost)
• High-speed DDR5 Memory, up to 48GB
• Intel Graphics supports DirectX 12.2, OpenGL 4.6, OpenCL 3.0, and Intel Deep Learning Boost
• High-speed data transfer : USB 3.2 Gen 2x2 (20Gbps), PCIe 4.0 (16GT/s), USB 3.2 Gen 2 (10Gbps), SATA III (6Gbps), 2.5GigE (2.5Gbps)
• Fully supports OpenVINO toolkits for AI Computing 

Advanced Integration

• Power Efficient : max 12-core 15W TDP AI-ready Processor
• Display Interface : HDMI 2.1, DisplayPort   
• GigE Vision : Dual 2.5GigE LAN, max 2.5Gbps data transfer   
• USB Vision : 10Gbps USB 3.2 Gen 2, 20Gbps USB 3.2 Gen 2x2 Type C
• External SIM socket for 5G/WiFi/4G/LTE/GPRS/UMTS wireless data transfer
• Smart System Management : Intel vPro, TCC, TSN, TPM 2.0, Wake on LAN, PXE, Remote Power Switch
• OpenVINO toolkits support 500+ AI models optimized for AI Computing

Flexible Configurations

• Compact M.2 sockets : Key B, Key E, and Key M
• Storage : SATA III, M.2 Key B, M.2 Key M
• Expansion : M.2 Key B, M.2 Key E
• Optional supports 5G, WiFi 6, 4G, LTE, GPRS, and UMTS Wireless Connection
• Optional SUMIT B for 10GigE LAN, 10G SFP+, 4G Networks, SIM Socket, or Fiber LAN expansion
• Supports Wallmount, DIN Rail, and VESA Mount mounting
• Versatile thermal solutions for operating requirements

Trusted Reliability

• Ultra-compact, small form factor   
• Fanless -40°C to 75°C Operation
• Wide Range Power Input : DC 9V to 55V 
• 16-mode Software Ignition Power Control optimized for in-vehicle computing 
• Trusted Intel LANs with longevity supported
• EN50155 and EN50121 trusted standards compliant
• Anti-shock and Anti-vibration